摘要 |
The present invention relates to a method for assembling a heat absorption block and a plurality of heat pipes with each other and an assembly thereof, and more particularly, to a method for assembling a heat absorption block, which is used as a cooling device for emitting the heat generated from a central processing unit mounted on a main board of a computer, and a plurality of heat pipes serving as an ultra thermal conduction element, and to an assembly of the heat absorption block and the heat pipes. |