| 摘要 |
PURPOSE:To shorten the time of wire bonding by setting an island or a lead frame and a chip to a carrier board and wire-bonding the island or the lead frame and the chip. CONSTITUTION:A chip 3 and a lead frame 2 are loaded and fixed onto a carrier board 1 capable of loading and fastening the chip 3 and the frame 2. The board 1 is moved and the chip 3 and the frame 2 are fed simultaneously to the positions of wire bonding, and bonding in which electrodes on the chip 3 and the lead terminals of the frame 2 are connected by metallic small-gage wires is conducted. Consequently, the frame 2 and the chip 3 can be heated together with the board 1 at the positions of wire bonding. The frame 2 and the chip 3 are heated previously together with the board 1, and can be wire-bonded. Accordingly, the time of wire bonding is shortened. |
