发明名称 WIRE BONDING METHOD FOR COATED WIRE
摘要 PURPOSE:To inhibit the melting and rising of a coating by gripping a coated wire to a section near a ball forming section by a chuck made of a metal, heating the ball forming section while being heated by the chuck and forming a ball. CONSTITUTION:A section between a capillary 5 and a section, to which a ball 4 is shaped, in a coated wire 1 is gripped by a heat-dissipating chuck 6 made of a metal. The ball 4 is formed by a discharge torch 7 under the state. Consequently, the mutual contacts of wire rods exposed from a coating 3, a wire-short, and contacts with a chip, etc., of the wire rods exposed, an edge-short, are not generated. Accordingly, the melting and rising of the coating 3 are inhibited.
申请公布号 JPH01319951(A) 申请公布日期 1989.12.26
申请号 JP19880151252 申请日期 1988.06.21
申请人 HITACHI LTD 发明人 KAWANA TAKESHI;KOJIMA TOSAKU;URAYAMA SATOSHI
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
主权项
地址