| 摘要 |
<P>PROBLEM TO BE SOLVED: To manufacture a multilayer wiring board having a fine wiring pattern pitch which is 10 μm or less at a high yield and low cost, and to provide a thin-film flip-chip semiconductor device which is advantageous on electrical characteristics by preventing multilayering from being forced more than is necessary. <P>SOLUTION: Multilayer thin-film wiring 9 is formed on the both sides of a base board 1 made of a flat metal or an alloy, the base board 1 is cut and divided into the surface side and a back side. Afterwards, the base board 1 is selectively removed so that an electrode pad part 2 can be exposed, and a flip-chip semiconductor chip 13 is mounted on this. <P>COPYRIGHT: (C)2004,JPO |
