发明名称 EPOXY RESIN COMPOSITION AND FILM ADHESIVE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent storage stability, and good dispersibility, and a film adhesive using the same. SOLUTION: The epoxy resin composition comprises 3-90 wt.% polymer obtained by polymerizing (a) 5-100 wt.% vinylimidazole derivative to be represented by formula (I) (wherein any one of R<SB>0</SB>, R<SB>1</SB>, R<SB>2</SB>, and R<SB>3</SB>is a vinyl group and each of the remaining is any one of hydrogen, a 1-18C aliphatic hydrocarbon group, a phenyl group, and a cyano group and may be the same or different) and (b) 0-95 wt.% ethylenically unsaturated monomer copolymerizable with the above (a) in the presence of a polymerization initiator in an epoxy resin. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003286334(A) 申请公布日期 2003.10.10
申请号 JP20020091909 申请日期 2002.03.28
申请人 HITACHI CHEM CO LTD 发明人 AICHI KATSUHIDE;NAGAI AKIRA;MOTOMURA KOJI;TAKEMURA KENZO
分类号 C09J7/00;C08G59/50;C09J145/00;C09J163/00;(IPC1-7):C08G59/50 主分类号 C09J7/00
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