| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing semiconductors which excels in moldability such as flowability and curability, and improves the soldering resistance of a semiconductor device by reducing elastic modulus and water absorption. SOLUTION: The epoxy resin composition for sealing semiconductors comprises (A) a phenol-aralkyl type epoxy resin, (B) a phenolic resin, (C) a molecular compound to be represented by the formula (wherein P is phoshorus; R<SB>1</SB>, R<SB>2</SB>, R<SB>3</SB>, and R<SB>4</SB>are each a substituted or nonsubstituted aromatic group or an alkyl group), and (D) an inorganic filler. COPYRIGHT: (C)2004,JPO
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