| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide the use of epoxy resin molding materials for sealing, which are optimal for the manufacture of an superior flow properties and this semiconductor device, where a semiconductor chip is disposed on multiple pins or a mounted board. <P>SOLUTION: Epoxy resin molding materials for sealing containing an epoxy resin (A), a hardening agent (B), a silane coupling agent containing secondary amino group (C), or a phosphate ester (D) are used as the sealing materials of a semiconductor device, equipped with the configurations of the following (a) to (f) as the combination of 1 or 2. That is, (a): at least one of the thickness of sealing materials on the upper face of a semiconductor chip and the back face of the semiconductor chip is 0.7 mm or smaller, b: the number of lead pins is 80 or larger, c: the length of wire is 2 mm or larger, d: pad pitches on the semiconductor chip are 90 μm or smaller, e: the thickness of a package, where a semiconductor chip is disposed on a mounted board is 2 mm or smaller, and f: the area of the semiconductor chip is 25 mm<SP>2</SP>or larger, and 1: the constitutions (a) or (e) and 2: the configuration (a) and at least one of the other configurations b to f. <P>COPYRIGHT: (C)2004,JPO |
