| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device for reducing power consumption at testing. <P>SOLUTION: A first semiconductor chip 2a and a second semiconductor chip 2b are laminated on a wiring board 1 on which wiring is formed. Then, the elements and wiring of the first and second semiconductor chips 2a and 2b are electrically connected with a bonding wire 4. Also, a solder ball 5 is bonded to the lower face of the wiring board 1, and electrically connected via wiring formed on the wiring board 1 to the elements of the first and second semiconductor chips 2a and 2b. Then, a controller 7 for controlling power supply is formed on the upper face of the wiring board 1. The controller 7 receives a control signal from the outside in a non-contact system, and controls a switching element according to a control signal, and switches a circuit for supplying a power. <P>COPYRIGHT: (C)2004,JPO</p> |
