| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which an electrical insulation layer having excellent wiring embeddability and surface flatness can be formed. SOLUTION: In this method, a film- or sheet-like resin molded product is laminated upon an internal substrate having a conductor circuit on its surface by heating and pressurizing the molded product through a heat-resistant rubber sheet by using a pressing plate. The rubber sheet has a thickness which is thicker than that of the conductor circuit within the range of≤20 times of the thickness of the conductor circuit. COPYRIGHT: (C)2004,JPO |
