THERMOCOMPRESSION BONDING DEVICE AND METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a thermocompression bonding device and a method there for, which are capable of surely connecting a wiring conductor such as TCP to a display independently of the fact that variations in the thickness of a glass board are somewhat large or protecting a connection pad against metallic corrosion, even if contaminants are present on the surface of the connection pad when a wiring conductor such as TCP is bonded with ACF by thermocompression in a repairing operation. SOLUTION: A liquid crystal cell 1 is mounted on a mounting pad 12, and the TCP 3 is bonded to the liquid crystal cell 1 through the intermediary of the ACF 4 by thermocompression by the use of a thermocompression bonding device 10. The pressing unit 22 of a heater tool is divided into a plurality of pressing sub-units, and the pressing sub-units are made to press the TCP 3. The pressing sub-units press the TCP successively against the end of the pad from its base. COPYRIGHT: (C)2004,JPO