| 摘要 |
PURPOSE: A tape attaching apparatus of a lead frame is provided to be capable of reducing the dispersion of heating temperature and preventing the outflow of an adhesive. CONSTITUTION: A tape attaching apparatus of a lead frame is provided with a lift part(21), a punch(23) for being moved up and down by the lift part, a die(24) having a punching hole(24a) for being inserted with the punch, and heater block part(30) located at the lower portion of the die. At this time, the heater block part includes a plurality of heater blocks(31,32) for carrying out a multi-step heating process at the lead frame wound with a tape(100). The tape attaching apparatus further includes a buffer part(40) installed at the lower portion of the heater block part.
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