| 摘要 |
PROBLEM TO BE SOLVED: To provide a pick-up apparatus which is capable of easily and quickly picking up from backing sheet semiconductor devices that are arranged at different positions and set different from each other in shape and size. SOLUTION: The semiconductor devices (12) are pasted on the top surface of a backing sheet (13), and a plurality of pushing pins (1) which are arranged below the undersurface of the backing sheet (13) and movable between a lower standby position and an upper pushing position are provided at the semiconductor device pick-up apparatus. Command signals are inputted through an input unit (5), one or more of the pushing pins (1) which are selected through a drive control circuit (4) and an actuator (2) are moved up to the pushing position in a vertical direction, and the pushing pins (1) push up the backing sheet (13) from below its undersurface to press the semiconductor devices (12) upward in a state where the semiconductor devices (12) are kept stable. COPYRIGHT: (C)2004,JPO |
