PROCESS AND APPARATUS FOR ELECTROPLATING PLATING SUBSTRATE HAVING SPECIFIC GRAVITY SMALLER THAN THAT OF PLATING SOLUTION

摘要

PROBLEM TO BE SOLVED: To provide an electroplating process which may form a uniform electrodeposited film on the entire surface of a plating substrate having a specific gravity smaller than that of a plating solution without leaving any trace of contact. SOLUTION: Electroplating is performed by keeping the plating substrate having a specific gravity smaller than that of the plating solution soaked in the plating solution with an electroconductive member which keeps the plating substrate soaked in a predetermined position in the plating solution and applying an electric current between the plating substrate and the electroconductive member while changing the relative positions of the plating substrate and the electroconductive member. COPYRIGHT: (C)2004,JPO