发明名称 |
METHOD FOR DEPOSITING METAL COATING ON SUBSTRATE |
摘要 |
FIELD: electrical engineering. SUBSTANCE: proposed method for depositing metal coating on polymeric-surface substrates for producing thin-structure printed-circuit boards with microscopic holes includes covering surface with electricity conducting polymeric layer followed by metal deposition; electricity conducting polymer used for the purpose is poly-3.4- ethylene hydroxithiophenon; prior to metal deposition it is brought in contact with copper (II) salt solution. EFFECT: improved bonding between conducting film and polymeric substrate; enhanced material growth of copper. 4 cl, 1 tbl |
申请公布号 |
RU2214075(C2) |
申请公布日期 |
2003.10.10 |
申请号 |
RU20000131601 |
申请日期 |
1999.05.14 |
申请人 |
BLASBERG OBERFLEKHENTEKHNIK GMBKH |
发明人 |
KHUPE JURGEN;FIKS SABINE;SHTAJNIUS ORTRUD |
分类号 |
H05K3/42;C23C18/16;C25D5/56;C25D7/00;C25D21/14;H05K3/18;H05K3/24 |
主分类号 |
H05K3/42 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|