发明名称 SUBSTRATE TREATMENT DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a substrate treatment device equipped with a detection sensor, which is capable of detecting both cutouts such as notches or the like in a substrate such as an Si wafer or the like possessing high reflectivity and other cutouts such as notches or the like in another substrate such as a transparent glass wafer or the like possessing low resistivity. <P>SOLUTION: The substrate treatment device is equipped with the detection sensor 2 which detects cutouts (notches 31) in the substrate (wafer 30). The device is provided with a light projector-photosensor 10 with a light source and a reflection-type detection unit and a photosensor 20 with a transmission- type detector. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2003289097(A) 申请公布日期 2003.10.10
申请号 JP20020091336 申请日期 2002.03.28
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 NAKAGOME KAZUHIRO
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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