EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE MADE BY USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, excellent in both temporary adhesiveness and moldability. SOLUTION: The epoxy resin composition contains: (A) an epoxy resin; (B) a phenolic resin; (C) an inorganic filler; (D) silane coupling agents comprising (d1) an epoxysilane coupling agent and (d2) at least one of a mercaptosilane coupling agent and an aminosilane coupling agent; and (E) a silicone oil represented by general formula (1) (wherein R is a monovalent organic group having a monovalent amino group; and n is an average value and is a positive number of 1 to 20). COPYRIGHT: (C)2004,JPO