| 摘要 |
PROBLEM TO BE SOLVED: To improve accuracy in the interlayer thickness of a substrate for multilayered printed wiring board without producing any defective molded product. SOLUTION: In a method of manufacturing a substrate for multilayered printed wiring board, a laminated board to the surface of which an uncured resin is adhered is used as an adhesive layer in a method of manufacturing multilayered printed wiring board by which a multilayered printed wiring board is manufactured, by forming a circuit on at least one copper-plated laminated board and superimposing, and integrating the laminated board upon and with the adhesive layer. COPYRIGHT: (C)2004,JPO |
