发明名称 HEAT-RADIATING PLATE MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a heat-radiating plate mounting device whose assembly workability can be facilitated. SOLUTION: In this heat-radiating plate mounting device for mounting a heat-radiating plate 3 via a spacer 2 on a substrate 1, the substrate 1 is provided with a penetrating part for penetrating the spacer 2 and a restraining part projected to the center of the penetrating part at the edge part of the penetrating part. The spacer 2 is provided with a screw part formed at the upper part and cut toward the lower part and an engaging part formed so as to be projected outward on the side face, and so as to be engaged with the restraining part. Then, the restraining part of the substrate 1 is engaged with the engaging part, and the heat-radiating plate 3 is mounted on the screw hole of the spacer mounted on the substrate by screwing the screw. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003289125(A) 申请公布日期 2003.10.10
申请号 JP20020091484 申请日期 2002.03.28
申请人 MITSUBISHI ELECTRIC CORP 发明人 YASUI MASAMI
分类号 H01L23/40;H01L23/36;(IPC1-7):H01L23/40 主分类号 H01L23/40
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