| 发明名称 |
METAL NANOPARTICLE CLUSTER INK AND METAL PATTERN FORMING METHOD USING IT |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a metal nanoparticle cluster ink and a metal pattern forming method using it. <P>SOLUTION: The metal nanoparticle cluster ink containing colloid metal nanoparticles and a bifunctional compound, and a method of forming a conductive metal pattern through a heat treatment process after forming the metal nanoparticle pattern on a substrate using a die made of a PDMS polymer as a stamp are provided. With this, conductive metal patterns of micrometer sizes can be easily formed on the surface of various substrates in a method with a simple process and without any expensive equipment, applications into various industrial fields are expected. <P>COPYRIGHT: (C)2004,JPO</p> |
| 申请公布号 |
JP2003288812(A) |
申请公布日期 |
2003.10.10 |
| 申请号 |
JP20020381872 |
申请日期 |
2002.12.27 |
| 申请人 |
SAMSUNG ELECTRONICS CO LTD;KOREA ADVANCED INST OF SCI TECHNOL |
发明人 |
CHEON JIN WOO;CHO SUNG NAM;PARK JONG IL;LEE KYUNG BOK;CHANG SEOK;HWANG SOON TAIK |
| 分类号 |
B82Y30/00;C09D11/00;C09D11/52;H01B1/22;H01L21/288;H01L21/768;H05K1/09;(IPC1-7):H01B1/22 |
主分类号 |
B82Y30/00 |
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