| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting system for mounting an electronic component on a printed wiring board, which is capable of mounting the electronic component on the printing board at an optimal mounting height independently of variations in the thickness of the printed wiring board. <P>SOLUTION: The electronic component mounting system 12 is equipped with a distance sensor 252 that is provided above a wiring board holding unit 18 so as to face downward in a vertical direction, the distance sensor 18 detects both the support plane 103 of the wiring board holding unit 18 and the surface 110 of the printed wiring board 60, and a detected value difference between the first detected value obtained by detecting the support plane 103 and the second detected value obtained by detecting the surface 110 can be acquired as the thickness of the printed wiring board 60. The height of the surface 110 is acquired from the thickness of the wiring board 60 and the previously known height of the support plane 103, the wiring board holding unit 18 is corrected for height, and a mounting operation is carried out. Independently of whether the printed wiring board varies in thickness or not, the surface 110 can be accurately set at a proper height, and the electronic component can be brought into contact with the surface 110 of the printed wiring board 60 at a sufficiently decelerated speed at mounting. <P>COPYRIGHT: (C)2004,JPO |
