| 摘要 |
PURPOSE: A semiconductor wafer coated with FRP(Fiber Reinforced Plastics), a semiconductor chip using the same, and a method for manufacturing the same are provided to be capable of reducing the manufacturing processes of the semiconductor chip and considerably improving the toughness of the semiconductor wafer and chip. CONSTITUTION: An IC(Integrated Circuit) pattern is formed at one side of a processed semiconductor wafer(S52). A polishing process is roughly carried out at the other side of the processed semiconductor wafer(S53). An FRP layer is thinly coated at the back side of the processed semiconductor wafer, wherein the FRP layer has a good tensile strength(S54). At this time, the thickness of the FRP layer is thinner than that of a semiconductor chip.
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