| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered printed wiring board in which signal lines can be laid at a high density while crosstalk noise is reduced. SOLUTION: In this multilayered printed wiring board in which signal lines are laid closely to each other in the same layer, grounding lines having the same width as the signal lines have are formed in parallel with the signal lines in the adjacent layer of the signal lines. COPYRIGHT: (C)2004,JPO |
