发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method by which a semiconductor device can be manufactured by using a laser-beam crystallization method which can prevent the remarkable fall of the mobility of a TFT due to grain boundaries formed in the channel forming region of the TFT, the decrease of an on-current, and the increase of an off-current, and to provide a semiconductor device manufactured by the method. SOLUTION: After a semiconductor film is formed so that the channel width of the film becomes almost equal to each width of crystal grains formed by using a continuously oscillated laser beam in the direction perpendicular to the scanning direction of the laser beam, single crystallinity is obtained in the channel forming region by irradiating the semiconductor film with the laser beam by aligning the moving direction of carriers with the scanning direction of the laser beam. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003289080(A) 申请公布日期 2003.10.10
申请号 JP20030011775 申请日期 2003.01.21
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI;TANAKA KOICHIRO;MIYAIRI HIDEKAZU
分类号 H01L21/20;H01L21/268;H01L21/336;H01L29/786;(IPC1-7):H01L21/336 主分类号 H01L21/20
代理机构 代理人
主权项
地址