| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which is capable of preventing solder electrodes from being deformed or bumps from cracking in a reliability test such as a thermal shock test. SOLUTION: A semiconductor chip equipped with solder projecting electrodes on its circuit surface is bonded to a circuit board in an area mounting method. Thermosetting resin is applied on the circuit board or the circuit surface (where solder projecting electrodes are formed) of the semiconductor chip and/or the circuit board mounted with it, the circuit board and the semiconductor chip are aligned with each other so as to electrically connect the electrodes to each other, then at least the solder projecting electrodes are heated above a solder melting point electrically connected to the circuit board, and then the resin is cured for the formation of the semiconductor device. The reaction rate of thermosetting resin composition is set at 40% or below or 70% or above immediately after the bonding-hardening process in the semiconductor device manufacturing method. COPYRIGHT: (C)2004,JPO
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