| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem wherein through-currents from another chip tend to flow to an output circuit, even at turning off of the power source of a chip itself at the mounting of a plurality semiconductor chips on the same package, and sharing the power source of the output circuits of these chips. <P>SOLUTION: The semiconductor device is added with a circuit for turning off a transistor configuring the output circuit of each semiconductor chip, for setting high impedance at the time of turning off a power source for an inside circuit of each semiconductor chip. This circuit can be realized by a using only simple device, such as an inverter. <P>COPYRIGHT: (C)2004,JPO |
