| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit component built-in module, mounted at high density to be suitably used for various electronic information apparatuses miniaturized with high performance, and to provide a method for manufacturing the component built-in module. SOLUTION: This circuit component built-in module (212) includes electrical insulating substrates (201, 201a), constituted of a mixture containing inorganic filler and heat-hardening resin, a plurality of wiring patterns (202a, 202b, and 202c) formed on at least the main surface of the electrical insulating substrate (201a), a semiconductor chip (203) built-in the electrical insulating substrates (201, 201a), and electrically connected to the wiring pattern (202c), and an inner via (204a) formed passing through the electrical insulating substrate (201a) so that the plurality of wiring patterns (202a, 202b) can be electrically connected. The thickness of the semiconductor chip (203) is set so as to be 30μm or larger and 100μm or smaller, and a non-wiring face becomes a grinding face, and the thickness of the circuit component built-in module (212) is set so as to be 80μm or larger and 200μm or smaller. COPYRIGHT: (C)2004,JPO
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