发明名称 SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate treatment device and a substrate treatment method capable of reducing the consumption of a treatment solution. SOLUTION: Rinse solution feeding nozzles 41a to 41g are disposed in parallel while being separated of almost equal intervals along a treatment solution feeding direction (scanning direction A) from one edge side SE to the other edge side EE of the substrate W at the time of supplying a rinse solution on the substrate W held by a substrate holding part. The rinse solution feeding nozzles 41a to 41g are respectively provided with discharge ports 43a to 43g each of whose discharge widths is almost equal to the width of the substrate W at each feeding position. Thus, it is possible to reduce the discharge of the rinse solution outside the substrate W at each feeding position, and to reduce the consumption of the rinse solution. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003289033(A) 申请公布日期 2003.10.10
申请号 JP20020091480 申请日期 2002.03.28
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 SANADA MASAKAZU;HARUMOTO MASAHIKO
分类号 G03F7/30;H01L21/027;H01L21/304;(IPC1-7):H01L21/027 主分类号 G03F7/30
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