发明名称 Wiring structure for an integrated circuit
摘要 A wire width and a wiring space of each of signal wires 1 and ground/power wires 2 are determined to be a wire width W1 (the minimum wire width) and a wiring space S1, respectively. A wire width and a wiring space of the via-hole neighboring region 1a or 2a are determined to be a wire width W2 (>W1) and a wiring space S2 (<S1), respectively. The wire widths W1 and W2 and the wiring spaces S1 and S2 are respectively determined so as to maintain the minimum wiring pitch P. The wiring space S1 is determined also so as to satisfy {S1/P>=0.6}. Further, the signal wires 1 and the ground/power wires 2 have the same wire thickness of a wire thickness T1 which allows an aspect ratio (T1/W1) to be equal to, or higher than, 2.
申请公布号 US2003189224(A1) 申请公布日期 2003.10.09
申请号 US20020261653 申请日期 2002.10.02
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 OHSAKI AKIHIKO;FUJISAWA MASAHIKO;MORIMOTO NOBORU
分类号 H01L21/3205;H01L21/82;H01L21/822;H01L23/528;H01L27/04;(IPC1-7):H01L27/10;H01L23/48;H01L23/52;H01L29/40 主分类号 H01L21/3205
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