| 摘要 |
A semiconductor device including a package body, a substrate contained within the package body and having a first side and an opposite second side, a first chip mounted on the first side of the substrate and within the package body, a second chip mounted on the second side of the substrate and within the package body and a plurality of leads each including an inner lead portion contained within the package body and an outer lead portion located outside the package body wherein each inner lead portion includes first and second bends to define a step configuration and wherein a distal end of each inner lead portion is mounted to the second side of the substrate.
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