| 发明名称 |
Chemical mechanical polishing with multiple polishing pads |
| 摘要 |
In chemical mechanical polishing, a substrate is planarized with one or more fixed-abrasive polishing pads. Then the substrate is polished with a standard polishing pad to remove scratch defects created by the fixed-abrasive polishing pads.
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| 申请公布号 |
US2003190865(A1) |
申请公布日期 |
2003.10.09 |
| 申请号 |
US20030425684 |
申请日期 |
2003.04.28 |
| 申请人 |
APPLIED MATERIALS, INC., A DELAWARE CORPORATION |
发明人 |
SOMEKH SASSON |
| 分类号 |
B24B7/22;B24B37/04;B24B49/12;B24D13/14;(IPC1-7):B24B49/00;B24B51/00;B24B1/00;B24B7/19;B24B7/30 |
主分类号 |
B24B7/22 |
| 代理机构 |
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代理人 |
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