发明名称 Method of forming a metal-insulator-metal capacitor
摘要 A metal-insulator-metal (MIM) capacitor of a semiconductor device, and a manufacturing method thereof, includes a lower electrode formed of a refractory metal or a conductive compound including the refractory metal, a dielectric film formed of a high dielectric material, and an upper electrode formed of a platinum-family metal or a platinum-family metal oxide. Accordingly, the MIM capacitor satisfies the criteria of step coverage, electrical characteristics and manufacturing costs, as compared to a conventional MIM capacitor in which the upper and lower electrodes are formed of the same material such as a platinum-family metal, a refractory metal or a conductive compound including the refractory metal. The capacitor is especially suitable for mass production in semiconductor fabrication processes.
申请公布号 US2003190808(A1) 申请公布日期 2003.10.09
申请号 US20030426743 申请日期 2003.04.30
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM WAN-DON;KIM JIN-WON;WON SEOK-JUN;YOO CHA-YOUNG
分类号 H01L21/02;H01L21/316;(IPC1-7):H01L21/302;H01L21/461 主分类号 H01L21/02
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