THERMOSETTING RESIN COMPOSITION AND ADHESIVE FILMS

摘要

A thermosetting resin composition comprising the following components (A) and (B); an adhesive comprising the thermosetting resin composition and an organic solvent and/or water; and adhesive films comprising the thermosetting resin composition: (A) at least one phenolic resin selected from the group consisting of alkylphenolic novolaks, adducts of aliphatic polymers having double bonds with phenol, and adducts of alicyclic polymers having double bonds with phenol, and (B) an epoxy-containing ethylenic copolymer obtained by polymerizing the components (b1) and (b2): (b1) ethylene and/or propylene, and (b2) a monomer represented by the general formula (1): (1) wherein R is a hydrocarbon group having 2 to 18 carbon atoms and a double bond, at least one hydrogen atom of which group may be replaced by halogen, hydroxyl, or carboxyl; and X is a single bond or carbonyl.