| 摘要 |
A semiconductor module is provided with a module substrate, a plurality of semiconductor chips formed on the module substrate, and a mold resin formed so as to integrally cover the plurality of semiconductor chips. Then, a plurality of trenches is formed on the main surface of the module substrate, so as to be parallel to one side forming the main surface, on the side on which the bare chips are formed. Thereby, a semiconductor module can be obtained wherein it is possible to restrict separation of the mold resin from the module substrate.
|
