| 摘要 |
A heat sink (28) is provided for removing heat from a component (30) on a circuit board (22). The heat sink (28) includes a base (12) having a top (14), a bottom (16), and opposing sides (18 and 20). The top is generally planar for being adhered to a circuit board. Each of the opposing sides has a cutout defining a stepped shoulder (26). The heat sink also includes a plurality of fins (24) extending from the bottom of the base. Locating structure (50) is provided on the top of the heat sink for locating the heat sink with respect to the circuit board (22). Since the heat sink can be glued to the circuit board, a common heat sink can be used for any power electronics component. |
