发明名称 Micro device and method for fabricating the same
摘要 In a micro device including a thin film wiring structure composed of plural thin film conductors, the thin film conductors are arranged on a base so as to be separated from one another by an inorganic insulating film. The gap width alpha between adjacent thin film conductors is defined by a thickness of the inorganic insulating film. The gap width alpha is set smaller than a width beta of each thin film conductor.
申请公布号 US2003189788(A1) 申请公布日期 2003.10.09
申请号 US20030397365 申请日期 2003.03.27
申请人 TDK CORPORATION 发明人 KAMIJIMA AKIFUMI
分类号 G11B5/17;G11B5/31;G11B5/39;H01F10/32;H01F17/00;H01F17/04;H01F41/04;H01L27/08;(IPC1-7):G11B5/147 主分类号 G11B5/17
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