| 摘要 |
<p>A polyarylene sulfide resin having a content of an oligomer which may be extracted by chloroform of 30 mg/g or less and having a total content of metal ions of 100 ppm or less. The polyarylene sulfide resin and a polyarylene sulfide resin composition containing the polyarylene sulfide resin and silica can be advantageously used as a sealing agent for electronic parts.</p> |
