| 发明名称 |
Package for optical semiconductor |
| 摘要 |
To provide a package for an optical semiconductor having a light-emitting device and a light-receiving device in one package, in which a groove is provided between the light-emitting device and the light-receiving device to thereby avoid rays of light from the light-emitting device to directly enter the light-receiving device.
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| 申请公布号 |
US2003189213(A1) |
申请公布日期 |
2003.10.09 |
| 申请号 |
US20030406943 |
申请日期 |
2003.04.03 |
| 申请人 |
IGAKI MASAHIKO;OGURA MAKOTO;ATSUTA AKIO;KOSAKA TADASHI |
发明人 |
IGAKI MASAHIKO;OGURA MAKOTO;ATSUTA AKIO;KOSAKA TADASHI |
| 分类号 |
H01L31/02;H01L31/12;H01L31/173;H01L33/54;H01L33/56;(IPC1-7):H01L31/12;H01L33/00 |
主分类号 |
H01L31/02 |
| 代理机构 |
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代理人 |
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