发明名称 |
Multilayer printed wiring board and method for manufacturing same |
摘要 |
A multilayer printed wiring board is formed with a plurality of conductor layers laminated as a whole with insulating layers interposed, a non-penetrating via hole provided in the insulating layer as bottomed by the conductor layer exposed, a plated layer provided inside the via hole for electric connection between the conductor layers, the via hole being formed to be of a concave curved surface of a radius in a range of 20 to 100 mum in axially sectioned view at continuing zone of inner periphery to bottom surface of the via hole, whereby the equipotential surfaces occurring upon plating the plated layer are curved along the continuing zone to unify the density of current for rendering the plated layer uniform in the thickness without being thinned at the continuing zone.
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申请公布号 |
US2003188888(A1) |
申请公布日期 |
2003.10.09 |
申请号 |
US20010808086 |
申请日期 |
2001.03.13 |
申请人 |
YOSHIOKA HIROKAZU;YOSHIDA NORIO;TANAKA KENICHIRO |
发明人 |
YOSHIOKA HIROKAZU;YOSHIDA NORIO;TANAKA KENICHIRO |
分类号 |
H05K3/46;H05K1/11;H05K3/00;H05K3/42;(IPC1-7):H05K1/11;H05K3/02 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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