INTEGRATED OPTOELECTRICAL CIRCUIT PACKAGE WITH OPTICAL WAVEGUIDE INTERCONNECTS
摘要
An integrated optoelectrical package for optoelectrical integrated circuits (ICs) is disclosed. The package includes a package substrate having contact receiving members on an upper surface. The contact receiving members are electrically connected to contacts on the lower surface. An optoelectronic receiver package and an optoelectronic transmitter package are each electrically mounted to respective first and second subsets of the contact receiving members. Input and output waveguide arrays are formed atop the substrate package and are optically coupled to the optoelectronic receiver package and the optoelectronic transmitter package, respectively. The contacts on the lower surface of the package substrate are designed to contact and engage the contact receiving members of a standard printed circuit board (PCB).
申请公布号
WO03083544(A2)
申请公布日期
2003.10.09
申请号
WO2003US04584
申请日期
2003.02.13
申请人
INTEL CORPORATION
发明人
CHAKRAVORTY, KISHORE;SWAN, JOHANNA;THOMAS, THOMAS;BARNETT, BRANDON;YOUNG, IAN;AHADIAN, JOSEPH