IC CHIP MOUNTING SUBSTRATE, IC CHIP MOUNTING SUBSTRATE MANUFACTURING METHOD, OPTICAL COMMUNICATION DEVICE, AND OPTICAL COMMUNICATION DEVICE MANUFACTURING METHOD

摘要

It is possible to provide an IC chip mounting substrate as an optical communication part in which an IC chip and an optical part are made into a unitary block, so that the distance between the IC chip and the optical part is short, the electric signal transmission has an excellent reliability, and an optical signal can be transmitted via an optical signal transmission path. On both sides of the IC chip mounting substrate, a conductive circuit and an inter-layer insulation layer are formed in layers and as the outermost layer, a solder resist layer is formed and an optical element is mounted. The IC chip mounting substrate is characterized in that an optical signal transmission path is arranged to penetrate the IC chip mounting substrate.