| 摘要 |
Production of a metal-ceramic substrate, especially a copper-ceramic substrate, comprises applying metal foils to the surface sides of a ceramic layer or a ceramic substrate (2) using a high temperature bonding process, and structuring the metal foils (3, 4) on at least one surface side to form conductor tracks, contact surfaces and the like. Production of a metal-ceramic substrate, especially a copper-ceramic substrate, comprises applying metal foils to the surface sides of a ceramic layer or a ceramic substrate (2) using a high temperature bonding process, and structuring the metal foils (3, 4) on at least one surface side to form conductor tracks, contact surfaces and the like. A layer (5) made from a solder stop lacquer is applied to the metal surface of at least the metal foil or at least a metallization after the high temperature bonding process. The high temperature bonding process is carried out at more than 650degrees C and is a direct bonding process or active soldering process. The layer of the solder stop lacquer is applied before or after structuring. The metal foils are made from copper. |
