发明名称 THINNER COMPOSITION FOR REMOVING PHOTOSENSITIVE RESIN
摘要 The present invention relates to a thinner composition for removing photosensitive resin, which is used in manufacture processes of semiconductor devices and liquid crystal display devices. The present invention provides a thinner composition comprising propyleneglycol monoalkyl ether acetate, cycloketone, polyethylene based condensate and fluorinated acrylic copolymer.
申请公布号 WO03083032(A1) 申请公布日期 2003.10.09
申请号 WO2003KR00632 申请日期 2003.03.28
申请人 DONGJIN SEMICHEM CO., LTD.;PARK, SOON-HEE;LEE, SANG-DAI;JUN, WOO-SIK 发明人 PARK, SOON-HEE;LEE, SANG-DAI;JUN, WOO-SIK
分类号 G03F7/32;C09D9/00;C11D3/37;C11D3/43;C11D11/00;G03F7/16 主分类号 G03F7/32
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