| 发明名称 |
SHEET MATERIAL AND ITS USE IN CIRCUIT BOARDS |
| 摘要 |
A sheet comprising thermoplastic polymer (TP) (4) and short high tensile modulus fibers (3) , in which the concentration of TP (4) in the middle of the sheet is higher than at the surface of the sheet, useful for making prepregs with a thermoset resin. |
| 申请公布号 |
WO03022020(A3) |
申请公布日期 |
2003.10.09 |
| 申请号 |
WO2002US27546 |
申请日期 |
2002.08.29 |
| 申请人 |
E.I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
SAMUELS, MICHAEL, R.;KAHN, SUBHOTOSH;MIKHAIL, LEVIT, R. |
| 分类号 |
B32B5/24;B29B13/10;B32B5/28;B32B15/14;B32B27/12;D04H1/00;D04H13/00;H01L23/14;H05K1/03 |
主分类号 |
B32B5/24 |
| 代理机构 |
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代理人 |
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