| 发明名称 |
Package for optical semiconductor |
| 摘要 |
A package 1 for an optical semiconductor having a light-emitting device 21 and a light-receiving device 31 in one package, in which a groove DW is provided between the light-emitting device and the light-receiving device to thereby avoid rays of light from the light-emitting device directly entering the light-receiving device. |
| 申请公布号 |
EP1351319(A2) |
申请公布日期 |
2003.10.08 |
| 申请号 |
EP20030252143 |
申请日期 |
2003.04.04 |
| 申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
IGAKI, MASAHIKO;OGURA, MAKOTO;ATSUTA, AKIO;KOSAKA, TADASHI |
| 分类号 |
H01L31/02;H01L31/12;H01L31/173;H01L33/54;H01L33/56;(IPC1-7):H01L31/12;H01L31/167 |
主分类号 |
H01L31/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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