| 摘要 |
The evaporation method of this invention comprises a process for tightly placing an evaporation mask on a substrate, and a process for disposing an evaporation material on the surface of the substrate through a plurality of openings formed in the evaporation mask by moving a plurality evaporation sources along the entire length of the substrate for forming a pattern. The evaporation sources are loaded with different evaporation materials. A plurality of evaporation layers can be continuously disposed on the substrate by sequentially or simultaneously moving the evaporation source. |
