发明名称 |
Semiconductor package and method for forming semiconductor package |
摘要 |
Electrodes of one face of a semiconductor 1 which has electrodes formed to both faces and a heat radiating plate 10, 14, 40 are directly joined to quickly absorb and diffuse heat of the semiconductor, thereby improving a heat radiation effect. At the same time, electrodes are connected with use of a wire thicker than a wire for wire bonding and larger in current capacity and can accordingly be utilized as a connecting terminal to a circuit board. Ceramic is used for the heat radiating plate, so that semiconductors of different functions can be mounted simultaneously. <IMAGE> |
申请公布号 |
EP1104024(A3) |
申请公布日期 |
2003.10.08 |
申请号 |
EP20000126050 |
申请日期 |
2000.11.29 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
NOBORI, KAZUHIRO;SAKAI, YOSINORI;ARISUE, KAZUO |
分类号 |
H01L23/31;H01L23/433;H01L23/485;H01L25/065 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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