发明名称 |
Electrical device comprising two substrates bonded together and method of making same |
摘要 |
An electrical device (100, 502, 602, 702) includes a plurality of integrated circuits (106) respectively fabricated in a first substrate (102) bonded to a second substrate (104) by a bond (111) that deforms above, but not below, a deformation condition. The deformation condition can be a predetermined pressure from opposing surfaces on the first and second substrates (102, 104) or is can be a predetermined combination of temperature and pressure from opposing surfaces on the first and second substrates (102, 104). |
申请公布号 |
EP1351285(A2) |
申请公布日期 |
2003.10.08 |
申请号 |
EP20030251979 |
申请日期 |
2003.03.28 |
申请人 |
HEWLETT-PACKARD COMPANY |
发明人 |
LIEBESKIND, JOHN;MCKINNELL, JAMES C.;BENNING, PAUL J.;CHEN, CHIEN-HUA |
分类号 |
H01L21/60;H01L25/18;B81B7/00;H01L21/50;H01L21/98;H01L23/02;H01L23/10;H01L25/065;H01L25/07 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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