发明名称 CIRCUIT BOARD, ELECTRONIC COMPONENT, AND THEIR MANUFACTURING METHODS
摘要 <p>A circuit board has a first electrode and a second electrode connected with respective electrodes of a chip and a first insulating layer with openings provided at respective positions corresponding to the first electrode and the second electrode. The openings of the first insulating layer are shaped so that the first insulating layer does not cover at least a region below the chip on the peripheral edges of the first and second electrodes.</p>
申请公布号 KR20030078634(A) 申请公布日期 2003.10.08
申请号 KR20030004539 申请日期 2003.01.23
申请人 发明人
分类号 H01L23/50;H05K3/28;H05K1/02;H05K3/34 主分类号 H01L23/50
代理机构 代理人
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