| 摘要 |
<p>A thin film circuit substrate comprising multilayer conductor layers (1,4) formed via insulating layers (2,3), wherein a signal transmission path (1) in at least one of the conductor layers is embedded in a low dielectric constant insulator (2), and the low dielectric constant insulator (2) is embedded in an insulator layer (3) with a good adhesiveness. The thin film circuit substrate has a low dielectric constant, and thus an improved signal propagation velocity, but since the low dielectric constant insulator (2) which intrinsically has a low adhesiveness, is entirely surrounded by the insulator layer (3) with good adhesiveness the interlayer adhesiveness is not lowered overall. <IMAGE></p> |
