| 摘要 |
PURPOSE: A circuit board for a semiconductor package is provided to prevent the circuit board and a semiconductor chip from being damaged by static electricity, by making the static electricity directly discharged toward a mold through a circuit pattern located in a region where a cover coat is open. CONSTITUTION: A chip mounting part(8) is so formed on a resin layer that a semiconductor chip can be mounted afterward. A plurality of circuit patterns(10) is radially and finely formed on a circumferential surface of the chip mounting part. A plurality of ball lands is arranged so that a conductive ball is melted and bonded to a lower surface of the resin layer. A conductive via hole(12) connects the circuit pattern on the resin layer with a ball land on a lower surface of the resin layer. A cover coat is coated on the upper and lower surfaces of the resin layer to protect the circuit pattern from the exterior surroundings and to make the ball land open to the exterior. An opening region(50) not coated with the cover coat is formed to make the circuit pattern in the periphery of an edge of the circuit board directly open to the exterior, wherein the circuit board is closely adhered by a mold in an encapsulation process.
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